Radio frequency probing apparatus for surface acoustic wave devices
US4626775A · kind A · utility
29Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 1984 |
| Grant date | Dec 2, 1986 |
| Priority date | — |
| Expiry date | May 4, 2004 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07342
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Wafer probing apparatus especially adapted to probing surface acoustic wave (SAW) device die such as delay lines is disclosed; the apparatus includes a probe card especially suited to the radio frequency and multiple output nature of a SAW delay line together with a computer-aided electronic system for exciting the delay line and evaluating its output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.