Equal density distribution process
US4627005A · kind A · utility
2Cited by
1References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1984 |
| Grant date | Dec 2, 1986 |
| Priority date | — |
| Expiry date | Sep 24, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A photograph artwork containing a one to one scale exact image of the circuit pattern to appear on a fabricated printed-wiring board is modified in a predetermined manner. This has the effect of equalizing the amount of metallic conductive circuits on a double sided printed wiring board or panel. The resulting board or panel is plated uniformly on both sides when passed through the electrodeposition cycle of a fabrication process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.