Molded shoe innersole
US4627178A · kind A · utility
84Cited by
5References
9Claims
0Family size
Inventors
Key dates
| Filing date | Sep 18, 1985 |
| Grant date | Dec 9, 1986 |
| Priority date | — |
| Expiry date | Sep 18, 2005 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA43B7/28
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A shoe-innersole material for use in providing cushioning and support in footwear, and a method of manufacturing the shoe-innersole material, the shoe innersole comprising a heel and an arch section composed of a molded, elastomeric polyurethane foam material of low compression set, the heel and arch sections directly bonded in the molding process to a full-sole material composed either of foam or a solid, flexible sheet material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.