Ceramic temperature stabilization body, and method of making same
US4627815A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1984 |
| Grant date | Dec 9, 1986 |
| Priority date | — |
| Expiry date | Oct 12, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B35/002
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The temperature stabilization body is made of pulverized aluminum nitride with a first additive of pulverized aluminum present between 0.05% to 2%, and a grain size of under 1 micrometer, and a second additive of from 0.1% to 10% of an oxide, preferably yttrium oxide, present at about 1%--all precentages by weight, in which the mixture is ground in a ceramic ball mill to a grain size of not over 0.1 mm, subjected to cold isostatic pressure in the order of 2500 bar to form a green, pressed body, and then sintered at a sintering temperature of between 1750.degree. C. to 2000.degree. C. The heat conductivity of the densely sintered aluminum nitride body will then be at least 140 W/m .degree.K., and a heat conductivity of twice as much can be obtained, the body being non-toxic and not subject to creep under temperatures up to at least 1700.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.