Mechanical locking between multi-layer printed wiring board conductors and through-hole plating
US4628598A · kind A · utility
20Cited by
11References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 2, 1984 |
| Grant date | Dec 16, 1986 |
| Priority date | — |
| Expiry date | Oct 2, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A plated through-hole conductor structure for a multiple layer laminate electronic printed wiring board includes mechanical locking of the plated through conductor with textured conductor surfaces together with use of etching or other processing to provide laminate internal space for the mechanical locking structure. A manufacturing sequence and plural material selections are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.