Apparatus for coating substrates by plasma polymerization
US4630568A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 21, 1985 |
| Grant date | Dec 23, 1986 |
| Priority date | — |
| Expiry date | May 21, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3382
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Apparatus for coating substrates by means of a reaction for depositing atoms or molecules which is initiated by a plasma. A reaction chamber (1) is equipped with at least one window (22, 23), penetrable by microwaves, with at least one wave-guide structure (16, 17), arranged outside the chamber (1) and in front of the window (22, 23), and with a distributing means (25) discharging into the chamber. According to the invention and for the purpose of achieving the object of facilitating inspection and repairs, the window (22, 23) penetrable by microwaves, the one or more wave-guide structures (16, 17) and the distributing means (25) are all secured in or on a support frame (10), which can be removed, or swung away, from the reaction chamber (1) as a single unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.