Bonding aluminum to refractory materials
US4630665A · kind A · utility
70Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1985 |
| Grant date | Dec 23, 1986 |
| Priority date | — |
| Expiry date | Aug 26, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22D19/14
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for bonding aluminum and aluminum alloys to refractory materials. A body of metal is heated to an elevated temperature at a total pressure above the vapor pressure of aluminum but less than atmospheric pressure. Oxygen partial pressure is maintained sufficiently low to prevent substantial oxidation of the metal. The heated body is contacted with a mass of refractory material and cooled, thereby forming a composite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.