Method for joining metal components to a substrate
US4631821A · kind A · utility
8Cited by
6References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 27, 1983 |
| Grant date | Dec 30, 1986 |
| Priority date | — |
| Expiry date | Dec 27, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fixing a pin to a ceramic substrate includes inserting the pin into a hole through the thickness of the substrate, restraining one end of the pin that extends from one surface of the substrate, and striking the end of the pin at the opposite end of the substrate with a force sufficient to form a head on the pin and to cause permanent radial expansion of the pin against the surface of the hole in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.