Semiconductor etching apparatus with magnetic array and vertical shield
US4632719A · kind A · utility
44Cited by
17References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 1985 |
| Grant date | Dec 30, 1986 |
| Priority date | — |
| Expiry date | Sep 18, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32642
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In an apparatus for etching a large semiconductor wafer the etch rate and uniformity of etching at the edges is improved by using an array of magnets behind the collector plate to form a double ring of plasma and using a grounded shield ring with perforations to pass gases. The shield ring extends both above and below the surface of the wafer being etched.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.