Process for the production of images after electrodeposition of positive photoresist on electrically conductive surface
US4632900A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 1985 |
| Grant date | Dec 30, 1986 |
| Priority date | — |
| Expiry date | Mar 7, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/138
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive photoresist is electrodeposited onto a substrate, exposed to actinic radiation in a predetermined pattern, and then exposed areas are removed by contact with a developer. When the substrate is a metal-faced laminate, the exposed metal surface may be etched and the residual electrodeposited layer removed by contact with a suitable solvent, optionally after a second, general, exposure to actinic radiation. Suitable electrodepositable positive photoresists include o-nitrocarbinol esters and o-nitrophenyl acetals, their polyesters and end-capped derivatives and quinone diazide sulphonyl esters of phenolic novolaks, having salt-forming groups in the molecule, especially carboxylic acid and amine groups. The process is suitable for the production of printing plates and printed circuits, especially circuits on both sides of a liminate sheet linked conductively through metal-lined holes in the sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.