Epoxy resin composition
US4632970A · kind A · utility
7Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1985 |
| Grant date | Dec 30, 1986 |
| Priority date | — |
| Expiry date | Dec 2, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/306
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition comprising: PA1 (a) a urethane modified epoxy resin obtained by reacting a compound having both epoxy and hydroxy groups with a urethane bond containing compound having an isocyanate group at the end thereof, which is obtained from (i) an organopolysiloxane compound having a molecular weight of 500 to 10000 and having at least two hydroxy groups per one molecule in the main chain or side chain thereof and (ii) a polyisocyanate compound; and PA1 (b) an active organic curing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.