Thermally stable capped thermoplastic phenolic resin
US4632971A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 15, 1985 |
| Grant date | Dec 30, 1986 |
| Priority date | — |
| Expiry date | Jul 15, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/688
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat stable thermoplastic phenolic resin is prepared by (I) reacting (A) the reaction product of (1) at least one epoxy resin having an average of more than one vicinal epoxy group per molecule such as a diglycidyl ether of bisphenol A with (2) one or more polyhydric phenols such as bisphenol A; and optionally (B) one or more polyhydric phenols such as bisphenol A; with (II) a material having only one vicinal epoxy group per molecule such as the glycidyl ether of t-butyl phenol or mixture of such materials; in the presence of an effective quantity of a suitable catalyst such as ethyltriphenylphosphonium acetate.acetic acid complex.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.