Patent · US Expired

Multiple-blade internal-hole saw for sawing crystalline rods

US4633847A · kind A · utility

26Cited by

6References

3Claims

0Family size

Assignee

Wacker-Chemie Gesellschaft fur Elektronik-Grundstoffe mbH · DE

Inventors

Gunter Lossl · Kirchweidach, DE
Helmut Zauhar
Horst Stock · Burghausen, DE

Key dates

Filing date	Apr 8, 1985
Grant date	Jan 6, 1987
Priority date	—
Expiry date	Apr 8, 2005

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB28D5/029
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

Crystalline rods or blocks can be sawed into thin wafers by sawing the rod or block into a plurality of wafers that are connected to each other. The wafers can be connected by introducing a connecting agent after each sawing step, into the resulting cutting gaps. The wafers are separated only after the whole rod has been sawed with a two-blade internal-hole saw.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.