Surface treatment process
US4634600A · kind A · utility
56Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1985 |
| Grant date | Jan 6, 1987 |
| Priority date | — |
| Expiry date | Jun 19, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/32
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate is treated for forming a thin film on the surface of the substrate to obtain a hard layer adhering to the substrate surface. For this purpose the substrate is placed in a metal vapor atmosphere and simultaneously bombarded by metal or nonmetal ions which are implanted into the substrate while the metal vapor atmosphere is also being ionized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.