Process for electroless metal deposition
US4634619A · kind A · utility
12Cited by
5References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 10, 1984 |
| Grant date | Jan 6, 1987 |
| Priority date | — |
| Expiry date | Feb 10, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/181
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed herein are processes for the electroless (chemical) plating of substrates incorporating polyelectrolytes to increase the catalytic site density prior to the electroless (chemical) metal deposition step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.