Flexible circuit laminate and method of making the same
US4634631A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1985 |
| Grant date | Jan 6, 1987 |
| Priority date | — |
| Expiry date | Jul 15, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit laminate is presented comprising a microglass reinforced fluoropolymer layer sandwiched between a polyimide substrate and a copper conductive pattern. The glass reinforced fluoropolymer acts as a high bond strength adhesive between the polyimide and copper conductive pattern. The glass reinforced fluoropolymer also contributes to improved dimensional stability as well as improved electrical performance. Preferably, the microglass content is between about 4 to about 30 weight percent, and more preferably about 20 weight percent glass. In a method of making the flexible circuit laminate, the polyimide substrate undergoes a preferably alkaline microetching surface treatment, followed by rinsing, drying and lamination to the microglass reinforced fluoropolymer and copper layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.