Method of manufacturing a circuit module
US4635356A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 1985 |
| Grant date | Jan 13, 1987 |
| Priority date | — |
| Expiry date | Aug 15, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Terminal-equipped electronic elements, such as chip resistors and chip diodes, are arranged such that one surface of each terminal contacts one surface of a support board, the support board being placed to face a flat plate through a spacer. An electrically insulative liquid synthetic resin is injected between the support board and the flat board and cured to form a synthetic resin layer burying the electronic elements. The support board, flat board and spacer are peeled from the electronic elements and the synthetic resin layer to expose one surface of the terminal of each electronic element on one surface of the synthetic resin layer. A conductive pattern is formed on the synthetic resin layer by screen printing to connect the terminals of the electronic elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.