Silver-glass paste for attachment of silicon die to ceramic substrate
US4636254A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1986 |
| Grant date | Jan 13, 1987 |
| Priority date | — |
| Expiry date | Mar 10, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S228/903
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Silver flake and lead borate glass frit are suspended in a liquid organic vehicle of resin and solvent. The silver flakes are present in two different size ranges. The plate is applied between the silicon die and the substrate and is oven fired to provide a bond that accommodates the different coefficients of thermal expansion of the silicon and ceramic substrate. The smaller silver particles improve the sintering of the silver and glass and thereby increase the bond strength while the larger silver particles minimize undersirable shrinkage and cracking of the resultant bond. Silver oxide particles or a special solvent mixture are also used in the paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.