Electroless plating bath for forming a nickel alloy coating having a high phosphorus content
US4636255A · kind A · utility
11Cited by
6References
9Claims
0Family size
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Key dates
| Filing date | May 22, 1985 |
| Grant date | Jan 13, 1987 |
| Priority date | — |
| Expiry date | May 22, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/36
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless plating bath for forming a nickel-phosphorus alloy coating having a high phosphorus content contains in water nickel ions, hypophosphite as a reducing agent for nickel ions, a pH adjustor, a pH buffering agent, a small amount of a stress reducing agent and tri(alkali metal) N-(2-hydroxyethyl)ethylenediamine-N, N', N'-triacetate as a first phosphorus deposition promotor. It may further contain at least one sulfate selected from ammonium sulfate, lithium sulfate, potassium sulfate and sodium sulfate as a second phosphorus deposition promotor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.