General technique for the integration of MIC/MMIC'S with waveguides
US4636753A · kind A · utility
233Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 1984 |
| Grant date | Jan 13, 1987 |
| Priority date | — |
| Expiry date | May 15, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/107
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A technique for packaging and integrating of a microwave integrated circuit (MIC) or monolithic microwave integrated circuit (MMIC) with a waveguide uses a printed conductive circuit pattern on a dielectric substrate to transform impedance and mode of propagation between the MIC/MMIC and the waveguide. The virtually coplanar circuit pattern lies on an equipotential surface within the waveguide and therefore makes possible single or dual polarized mode structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.