Methods for selectively removing adhesives from polyimide substrates
US4639290A · kind A · utility
8Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 1985 |
| Grant date | Jan 27, 1987 |
| Priority date | — |
| Expiry date | Dec 9, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0554
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods for forming holes of predetermined size in polyimide substrates having metallic layers adhesively attached thereto include selectively removing areas of desired size and shape from the metallic layer; contacting the exposed adhesive layer with a selective etchant therefor that does not affect the polyimide substrate or undercut the adhesive near the opening formed; and selectively etching the polyimide substrate exposed in the openings by removal of the adhesive layer overlying the polyimides. These methods permit rapid, efficient formation of holes having a diameter as small as one mil (0.00254 cm).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.