Hermetic sealing cover and a method of producing the same
US4640436A · kind A · utility
21Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 1986 |
| Grant date | Feb 3, 1987 |
| Priority date | — |
| Expiry date | Mar 5, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hermetic sealing cover assembly for a semiconductor device, etc. has a seal ring and a metallic cover joined thereto. The seal ring has a thin layer of gold, silver, platinum or palladium. The cover has a film of a material of high solderability, such as gold or nickel, formed at least on the peripheral edge of its surface facing the seal ring. The ring is joined in its entirety to the peripheral edge of the cover so that the layer on the ring may be bonded to the film on the cover. A method of producing such a sealing cover assembly is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.