Process for accelerating Pd/Sn seeds for electroless copper plating
US4640718A · kind A · utility
6Cited by
6References
5Claims
0Family size
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Key dates
| Filing date | Oct 29, 1985 |
| Grant date | Feb 3, 1987 |
| Priority date | — |
| Expiry date | Oct 29, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/28
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Pd/Sn seeds for use in electroless copper plating are accelerated by treating them with an alkali metal hydroxide at a pH of about 11.3 and at a temperature above 50.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.