Process for producing a cutting base
US4640745A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1985 |
| Grant date | Feb 3, 1987 |
| Priority date | — |
| Expiry date | Sep 9, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Process for producing a sound recording cutting base, which includes precipitating a cuttable copper layer on a substrate from an electroplating bath, the copper layer having an initial grain size and having recrystallizing characteristics as a result of the bath's composition, convection and current density, characterized in that in order to extend recrystallization time, substances are added to the bath which, by their incorporation in the copper layer, stabilize the latter in such a manner that recrystallization is prevented or delayed, the substances including leveling agents added in effective amounts to prevent formation of layer-grain crystals of copper having a grain size which substantially exceeds the initial grain-size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.