Printed circuit board
US4640866A · kind A · utility
65Cited by
5References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 1, 1985 |
| Grant date | Feb 3, 1987 |
| Priority date | — |
| Expiry date | Apr 1, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31544
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board is provided comprising at least one layer of metal firmly bonded in laminar contact with at least one layer of solid, sintered polytetrafluoroethylene (PTFE). In one embodiment, the solid PTFE layer contains fibers of porous, expanded, sintered PTFE mixed within it. In another embodiment, the solid PTFE layer is firmly bonded to the metal layer on one side and is firmly bonded on the other side to a layer of porous, expanded, sintered PTFE.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.