Compliant interconnection and method therefor
US4642889A · kind A · utility
184Cited by
5References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 29, 1985 |
| Grant date | Feb 17, 1987 |
| Priority date | — |
| Expiry date | Apr 29, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and device for compliantly interconnecting a surface mount device or the like to a circuit board is taught. Briefly stated, an interposer having interconnect areas is placed between the circuit board and the device to be surface mounted with interconnect areas disposed between conductive strips on the circuit board and pads contained on the surface mount device. The interconnect area has disposed therein a plurality of fine wires having flux and solder disposed thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.