Combined continuous plating apparatus for hot-dip plating and vacuum deposition plating
US4643131A · kind A · utility
5Cited by
3References
4Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 20, 1985 |
| Grant date | Feb 17, 1987 |
| Priority date | — |
| Expiry date | Sep 20, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/562
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a combined continuous plating apparatus for hot-dip plating and vacuum deposition plating characterized in that the outlet of the gas reduction annealing furnace of a conventional continuous hot-dip plating apparatus and the inlet of the seal roll chamber of a known continuous vacuum deposition plating apparatus are connected through a pressurized chamber in order to prevent invasion of hydrogen-containing reduction gas into the vacuum deposition chamber, whereby is prevented the possibility of the hydrogen-containing gas causing an explosion should air leak into the vacuum deposition chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.