Process for treating metal surface
US4643793A · kind A · utility
19Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1985 |
| Grant date | Feb 17, 1987 |
| Priority date | — |
| Expiry date | Jul 1, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for treating a surface of a metal such as copper with a liquid composition comprising (I) copper ions, a complexing agent, a reducing agent, a pH adjusting agent, water, and (II) a nitrogen-containing organic compound such as heterocyclic compound or containing --N.dbd. and --NH.sub.2 and/or --OH groups in its molecule can give multilayer printed wiring boards having excellent adhesive strength and line definition of inner layer copper conductors with long shelf life.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.