Surface mounting package
US4644096A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1985 |
| Grant date | Feb 17, 1987 |
| Priority date | — |
| Expiry date | Mar 18, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modified TO-8 package has a kovar header supporting an FET amplifier hermetically sealed by a cover welded along the seam between the cover edge and header edge. The header is formed with three circular openings in space quadrature about the package axis. A circular copper spacer contacts the header and is formed with channels extending radially outward from the header openings to define with the openings three lead channels. A lead having a right angle bend is seated in each channel having an upstanding pin portion above the header. The volume between the lead and the header is filled with hermetically sealing low expansion borosilicate glass. The remainder of each channel is filled or coated with nonconductive epoxy. The depending portions of the leads are flush with the bottom of the copper spacer. In another form the base and cover are rectangular in the form of a four-lead DIP package also having the channels, right-angle-bent leads flush with the bottom surrounded by hermetically sealing insulating low expansion borosilicate glass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.