Process for fabricating dimensionally stable interconnect boards
US4645552A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1984 |
| Grant date | Feb 24, 1987 |
| Priority date | — |
| Expiry date | Nov 19, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
We disclose a process for manufacturing multilayer circuit boards which includes providing a conductive, or an insulating substrate with a conductive pattern thereon, and then transferring and firing a glass-ceramic tape layer to the surface of the substrate. This tape layer provides both electrical isolation between the substrate and electrical conductors or electronic components which are subsequently bonded to or mounted on the top surface of the glass-ceramic tape layer. By providing vertical electrical conductors by means of vias in the tape layer prior to firing the tape layer directly on the substrate, good X and Y lateral dimensionally stability of the tape material is maintained. In addition, a high quality thick film glass-ceramic electrical interconnect structure is achieved at a relatively low manufacturing cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.