Shielded interconnection boards
US4646436A · kind A · utility
19Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 1985 |
| Grant date | Mar 3, 1987 |
| Priority date | — |
| Expiry date | Oct 18, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Discloses a method for making a coaxial conductor interconnection circuit board, as well as the board per se, by providing a first conductive coating on a substrate, scribing an insulated wire signal conductor pattern on the first coating and a second conductive coating over the wire to provide a conductive shield surrounding the wire, eliminating conductive material from the coatings in clearance areas at terminal points and drilling at the terminal points by laser beam or mechanical drilling to expose the signal conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.