Multi-wafer slicing with a fixed abrasive
US4646710A · kind A · utility
199Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 1983 |
| Grant date | Mar 3, 1987 |
| Priority date | — |
| Expiry date | May 5, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9292
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafering machine having a multiplicity of wire cutting blades supported by a bladehead reciprocally moving past a workpiece supported by a holder that rocks about an axis perpendicular to the wires at a frequency less than the reciprocation of the bladehead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.