Fluxless soldering process using a silane atmosphere
US4646958A · kind A · utility
23Cited by
4References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 31, 1985 |
| Grant date | Mar 3, 1987 |
| Priority date | — |
| Expiry date | Oct 31, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3489
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Solder reflow or solder chip joining can be accomplished in a fluxless system by conducting the solder reflow or chip joining procedure in a carrier gas which comprises from about 0.1 to about 10% by volume SiH.sub.4, based on the volume of carrier gas and SiH.sub.4. A preferred carrier gas for the reflow is hydrogen and a preferred carrier gas for the chip joining is nitrogen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.