Mounting device for a thick layer electronic module
US4648008A · kind A · utility
22Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 3, 1985 |
| Grant date | Mar 3, 1987 |
| Priority date | — |
| Expiry date | Jul 3, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device is provided for mounting a thick layer component, more especially for an electronic module. Said component comprises a thick layer deposited on a face of an electrically insulating support. This face is, in the mounted position, on the same side as a heat sink, whereas the thick layer is separated from the heat sink by an electrically insulating and heat conducting device of a given flexibility which accommodates the imperfections of the thick layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.