Flexible envelope for electronic component packaging
US4648508A · kind A · utility
22Cited by
5References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 19, 1985 |
| Grant date | Mar 10, 1987 |
| Priority date | — |
| Expiry date | Jun 19, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/922
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention features a single film construction with two distinctly different surface characteristics for the purpose of an electronic package composite. The non-abrading outside conductive layer integrally bonded to an anti-static interior layer forms a faraday cage package characterized by surface resistivities of less than 10.sup.3 ohms per square on the outside and less than 10.sup.12 ohms per square on the inside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.