Method and apparatus for achieving reduced component failure during soldering
US4648547A · kind A · utility
5Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 1985 |
| Grant date | Mar 10, 1987 |
| Priority date | — |
| Expiry date | Jun 26, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/081
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Failure of an electronic component (18) during soldering of leads (16--16) thereof to a substrate (12) can be reduced by directing a gas such as air across the top surface (13) of the substrate against the leads. The gas directed against the leads serves to drive off corrosive flux vapors which would otherwise migrate upwardly along the leads causing corrosion thereto and failure of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.