Apparatus and method for controlling plating induced stress in electroforming and electroplating processes
US4648944A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 1985 |
| Grant date | Mar 10, 1987 |
| Priority date | — |
| Expiry date | Jul 18, 2005 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/26
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Internal stress on an object being electroplated is monitored continuously with a gauge. The gauge includes a metal receptor which is employed as a second cathode in the electrodeposition process. A separate plating current is supplied between the anode and second cathode, distinct from the separately controllable current between the anode and object being plates or electroformed. The stress on the second cathode is measured with a strain gauge, and a stress deviation from a desired plating stress is determined. The currents between the anode and first and second cathodes are adjusted in accordance with the measured internal stress on the metal receptor to achieve a desired stress condition. The internal stress is advantageously monitored with a foil resistance strain gauge. The strain gauge is connected to a carrier disposed in parallel with the metal receptor. The carrier is rigidly connected at opposite ends to the metal receptor. A stress transmission link centrally located between ends of the metal receptor and the carrier transmits the force applied by the electroplating material on the receptor to the carrier. The strain gauge provides an indication of the stress which resul…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.