All metal flat package for microcircuitry
US4649229A · kind A · utility
21Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1985 |
| Grant date | Mar 10, 1987 |
| Priority date | — |
| Expiry date | Aug 12, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flat package for electric microcircuits has an iron-nickel-cobalt alloy frame which is brazed to a molybdenum bottom at a temperature below about 400.degree. C. The molybdenum bottom has successive layers of copper, nickel and gold plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.