Method for forming hermetic seals
US4650108A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 15, 1985 |
| Grant date | Mar 17, 1987 |
| Priority date | — |
| Expiry date | Aug 15, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/86
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A firmly adherent film 16 of bondable metal, such as silver, is applied to the surface 10 of glass or other substrate by decomposing a layer 14 of a solution of a thermally decomposable metallo-organic deposition (MOD) compound such as silver neodecanoate in xylene. The MOD compound thermally decomposes into metal and gaseous by-products. Sealing is accomplished by depositing a layer 18 of bonding metal, such as solder or a brazing alloy, on the metal film and then forming an assembly with another high melting point metal surface 20 such as a layer of Kovar. When the assembly is heated above the temperature of the solder, the solder flows, wets the adjacent surfaces and forms a hermetic seal between the metal film 14 and metal surface 20 when the assembly cools.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.