Polyimide embedded conductor process
US4650545A · kind A · utility
21Cited by
9References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1985 |
| Grant date | Mar 17, 1987 |
| Priority date | — |
| Expiry date | Feb 19, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A polyimide embedded conductor process assures adherence of a metal conductor to a polyimide layer and allows closer spacing between conductors. The conductor is laid on a sacrificial substrate, and then the polyimide layer is laid over the conductor and substrate. The substrate is etched away to expose the conductor, and the polyimide layer may be etched away from the conductor to form attachment tabs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.