Soldering apparatus
US4651916A · kind A · utility
5Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1984 |
| Grant date | Mar 24, 1987 |
| Priority date | — |
| Expiry date | Dec 21, 2004 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering apparatus comprises a solder bath, an applicator for applying solder to a joint or the like to be soldered and a pump for pumping solder substantially continuously through the applicator. The applicator is movable vertically relative to the solder bath to solder a joint positioned above the bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.