Bonding poly(vinylidene chloride)
US4652327A · kind A · utility
6Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1985 |
| Grant date | Mar 24, 1987 |
| Priority date | — |
| Expiry date | Mar 22, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3175
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention discloses the use of dimer based polyamide compositions as hot melt adhesives for poly(vinylidene chloride).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.