Sputtering cathode
US4652358A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1984 |
| Grant date | Mar 24, 1987 |
| Priority date | — |
| Expiry date | Aug 24, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to a cathode system for sputtering apparatus which includes a target plate of ferromagnetic material. A magnet system is situated behind the target plate and has opposed poles positioned so that at least a portion of the lines of force emerging from the poles passes out through the target and returns thereto. The target is placed on a floor which includes strips of ferromagnetic material in the area of the poles of the magnet system. These strips close the magnetic circuit between the magnet system and the target plate. The remainder of the floor is made of nonmagnetic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.