Method and structure for effecting engineering changes in a multiple device module package
US4652974A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 28, 1985 |
| Grant date | Mar 24, 1987 |
| Priority date | — |
| Expiry date | Oct 28, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a semiconductor module with a substrate having a plurality of semiconductor devices mounted on the top surface, an internal metallurgy system interconnecting the devices, an auxiliary set of conductive lines with periodically occurring surface connecting terminals, engineering change terminals with electrical connections to the device terminals and to the internal metallurgy system, the improvement being PA0 engineering change devices, PA0 terminals on the engineering change devices to establish electrical contact with the engineering change terminals and the surface connecting terminals, PA0 a tailorable metallurgy system which permits establishing selective electrical connections between individual terminals of the engineering change devices, and PA0 deletable surface lines on the substrate to selectively electrically isolate selected engineering change terminals from the internal metallurgy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.