Adhesive compositions
US4654382A · kind A · utility
9Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 1985 |
| Grant date | Mar 31, 1987 |
| Priority date | — |
| Expiry date | May 24, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive composition comprising, by weight, (1) 100 parts of triglycidyl ether of trisphenol, (2) 0-40 parts of a polyfunctional epoxy resin, (3) a diamine type curing agent selected from (a) an aromatic diamine compound and (b) a reaction product having an amino group at each terminal thereof, prepared by reacting together an aromatic diamine compound, divinylsilane compound and bismaleimide compound, and, if desired, (4) a powdery inorganic filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.