Method for reflow soldering of surface mounted devices to printed circuit boards
US4654502A · kind A · utility
25Cited by
5References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 13, 1985 |
| Grant date | Mar 31, 1987 |
| Priority date | — |
| Expiry date | Sep 13, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A multi-zone thermal process system utilizing nonfocused infrared panel emitters. An insulated housing has a plurality of zones each having separate panel emitters which heat a product load traveling through the zone and in close proximity to said panel(s) at different peak wavelengths in each zone. The panel emitters emit infrared wavelengths in the middle and far regions. The temperature differences across each zone and between the panel and product are held to a minimum. A specific application of the system is for accomplishing reflow soldering of surface mount devices to printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.