Process for a thermal treatment of a polysilazane containing .tbd.SiH groups and .tbd.Si--NH-- groups
US4656300A · kind A · utility
18Cited by
4References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 25, 1986 |
| Grant date | Apr 7, 1987 |
| Priority date | — |
| Expiry date | Jun 25, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process for the thermal treatment of a polysilazane at a temperature from about 40.degree. C. to 220.degree. C. The polysilazane contains on average at least two, preferably at least three, .tbd.SiH groups per molecule and at least two ##STR1## groups and, if appropriate, unsaturated aliphatic hydrocarbon groups bonded to the silicon atoms. The polysilazanes treated in this manner have good thermal behavior and can be used in particular as precursors of ceramic products with a high yield of inorganic products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.