Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer
US4657986A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1985 |
| Grant date | Apr 14, 1987 |
| Priority date | — |
| Expiry date | Dec 23, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resinous composition comprising: PA0 (A) an organic elastomeric polymer having at least one silicon-containing reactive group in a molecule, PA0 (B) an epoxy resin, PA0 (C) a silicone compound having a silicon-containing group and a functional group reactive with an epoxy group, and PA0 (D) a curing agent for the epoxy resin, wherein said silicon-containing reactive group is a group of the formula: ##STR1## wherein X is a hydroxyl group or a hydrolyzable group, R.sup.1 is a monovalent hydrocarbon group having 1 to 20 carbon atoms or an organosiloxy group, "a" is 0, 1, 2, or 3, "b" is 0, 1 or 2 provided that the total of "a" and "b" is at least 1, and "m" is 0 or an integer of 1 to 18, a weight ratio of (A) to (B) being from 1:100 to 100:1 and a weight ratio of (A)+(B) to (C) being from 100:0.1 to 100:20.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.