High temperature molds and composition for same
US4658886A · kind A · utility
8Cited by
4References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1985 |
| Grant date | Apr 21, 1987 |
| Priority date | — |
| Expiry date | Sep 11, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K23/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A high temperature mold assembly particularly adapted for thermit reaction welding, and mold components and mold compositions therefor, based on a mined aggregate containing carbon and silica and thermosetting, non-hygroscopic resinous binder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.