Device for attaching modular electronic components to or removing them from an insulative device
US4659004A · kind A · utility
42Cited by
9References
31Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 10, 1984 |
| Grant date | Apr 21, 1987 |
| Priority date | — |
| Expiry date | Sep 10, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/34
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device is disclosed for attaching to or removing modular electronic components from a substrate which is adjustably positioned beneath a heater means delivering a flow of uniformly heated air. The heated air is directed to the sides of the component to melt solder associated with terminals thereon by a series of changeable nozzles which can be moved into or out of registry with the component. Vacuum means is also provided for contacting the component to position it on or remove it from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.